ModuTech Has Been Selected as a Company in the “Qingteng TECH300 New-Quality Productive Forces Demonstration Projects”
The Bay Area’s First “Science and Technology Innovation Ivy” Technology Transfer Matchmaking Event was held with great fanfare at Southern University of Science and Technology on June 26–27, 2026.
The conference was co-hosted by the Shenzhen Municipal Bureau of Science, Technology, and Innovation, the Qianhai Administration Bureau, the Nanshan District People’s Government, and Southern University of Science and Technology, and jointly organized by the Shenzhen Center for the Promotion of New-Quality Productive Forces and the Shenzhen Venture Capital Association, with Xinhua News Agency “Xinhua Insights","Investment Circle," "ChinaVenture," "Yicai," "Securities Times," and many other mainstream financial media outlets provided comprehensive coverage and reporting throughout the event.
As a major industry event focused on bringing cutting-edge scientific and technological innovations to market and facilitating collaboration among industry, academia, research institutions, and investors, this matchmaking event is dedicated to selecting flagship science and technology innovation projects from the Guangdong-Hong Kong-Macao Greater Bay Area.ModuTech was selected for the project “Research and Development of Key Technologies for Flexible Tactile Sensors for Embodied Intelligence”Qingteng TECH 300 New-Quality Productive Forces Demonstration Project—ModuTech specializes in haptic sensing technology, leveraging multimodal perception technology to endow robotic dexterous hands with human-like tactile senses. The company has integrated the entire value chain—from materials to algorithms to modules—and its technology has reached internationally advanced levels, making it a high-quality project for achieving domestic substitution in the perception layer of embodied intelligence.
Addressing common industry challenges that have long persisted—such as limited measurement ranges, high costs, and insufficient accuracy and sensitivity—ModuTech fromSensor MaterialsStarting with R&D, we cover everything from manufacturing processes and module packaging to fully automated AI calibration systems, achieving full-stack in-house development of core technologies and using innovative technical solutions to help overcome industry pain points.Among the company's current products,The MoFi haptic module, MoTe industrial pressure distribution system, and FleMo fabric sensor have all been implemented on a large scale,It has also established in-depth partnerships with several leading robotics and dexterous-hand companies, as well as major clients in the new energy and industrial manufacturing sectors.
It is worth noting that ModuTech’s new product, the MoVi Six-Dimensional Visual-Tactile Force Sensor, has officially launched this year, delivering higher-precision sensing and featuring a breakthrough upgrade in its algorithms:
0.1 N minimum actuation force
Precise Measurement of Normal Force, Tangential Force, and Torque
Clear identification of 3D morphology and slip
Supports customization of various shapes and sizes, such as grippers and finger modules
ModuTech is committed to advancing the development and application of next-generation multimodal haptic sensing technology. Its selection as a “New Quality Productive Forces” demonstration project at the Sci-Tech Innovation Qingteng Technology Transfer Matchmaking Conference,This not only serves as authoritative recognition of the company’s core technologies, but also builds a solid bridge for connecting with capital and integrating the upstream and downstream segments of the industrial chain.In the future, ModuTech will continue to transform technological potential into practical momentum, driving the development of embodied intelligence. By providing foundational support through haptic sensing solutions for the cultivation of new-quality productive forces in the Guangdong-Hong Kong-Macao Greater Bay Area, the company will effectively advance the domestic embodied intelligence industry toward high-end development.
